Schmalkalden University of Applied Sciences hosts WaferBond’22
October 4th to 6th, 2022
WaferBond’22 – The International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration will be held in Schmalkalden, Germany. It will be hosted by Schmalkalden University of Applied Sciences – powered by VDWF.
The conference will be held in English and cover all aspects of bonding wafers and comparable substrates from basic research to industrial applications, so that we welcome any contributions on these topics. Within this general approach the focus this year will be on the following topics:
- Fundamentals of wafer bonding and new developments in wafer bonding technologies
- Metrology for Wafer Bonding processes and bonded wafer stacks
- Direct and surface activated wafer bonding
- Wafer Bonding in Industrial Processes: Process Stability and Reliability
- Metal and glass-based Wafer Bonding Technologies
- Adhesive and Temporary Wafer Bonding for Wafer Thinning and Thin Wafer Handling
- System Integration by Wafer Bonding
- Enabling new Technologies and Devices for modern Applications by Wafer Bonding
- Wafer Bonding for Electronics and Multisystem Integration
- The future of Wafer Bonding, new ideas approaches and applications
